Located on the Castlegate Business Park in Caldicot the International Microsemi Corporation’s Advanced Packaging Business deliver a competitive advantage for its customers through miniaturising electronic circuits, enabling wireless connectivity and developing novel energy sources for medical devices.
With a track record of success in designing and developing miniaturised electronic modules, Microsemi’s Advanced Packaging Business is at the heart of mission-critical projects in such applications as pacemakers, neurostimulators, sensors, hearing aids and patient monitoring.
In February 2015 Microsemi were successful in drawing down £400,000 research and development funding from the EU’s Horizon 2020 programme to develop a photonic band aid as a special plaster that uses light to speed up healing and can also monitor wounds during treatment. Previously, Technology development were underpinned through TSB and FP7 collaborations with leading research organisations and companies where Microsemi played a leading role in management and exploitation. Recent projects include energy harvesting, In/On body wireless communications and embedded components to drive the next generation of 3D miniaturisation.
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